1. product pro?le 1.1 general description general purpose schottky diode, encapsulated in a sod123f small and ?at lead smd plastic package. 1.2 features n small and ?at lead smd plastic package n flat leads: excellent coplanarity and improved thermal behavior n low capacitance n high switching speed n low leakage current n high breakdown voltage 1.3 applications n ultra high-speed switching n voltage clamping 1.4 quick reference data [1] pulse test: t p 300 m s; d 0.02. BAS70H general-purpose schottky diode in small sod123f package rev. 01 25 april 2005 product data sheet table 1: quick reference data symbol parameter conditions min typ max unit i f forward current - - 70 ma v f forward voltage i f =10ma [1] - - 750 mv v r reverse voltage - - 70 v
9397 750 14967 ? koninklijke philips electronics n.v. 2005. all rights reserved. product data sheet rev. 01 25 april 2005 2 of 8 philips semiconductors BAS70H general-purpose schottky diode in small sod123f package 2. pinning information [1] the marking bar indicates the cathode. 3. ordering information 4. marking 5. limiting values [1] t j = 25 c prior to surge. [2] device mounted on an fr4 printed-circuit board (pcb), single-sided copper, tin-plated and standard footprint. table 2: pinning pin description simpli?ed outline symbol 1 cathode [1] 2 anode 2 1 sym001 12 table 3: ordering information type number package name description version BAS70H - plastic surface mounted package; 2 leads sod123f table 4: marking codes type number marking code BAS70H ah table 5: limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v r reverse voltage - 70 v i f forward current - 70 ma i frm repetitive peak forward current t p 1s; d 0.5 - 70 ma i fsm non-repetitive peak forward current t p 10 ms [1] - 100 ma p tot total power dissipation t amb 25 c [2] - 375 mw t j junction temperature - 150 c t amb ambient temperature - 65 +150 c t stg storage temperature - 65 +150 c
9397 750 14967 ? koninklijke philips electronics n.v. 2005. all rights reserved. product data sheet rev. 01 25 april 2005 3 of 8 philips semiconductors BAS70H general-purpose schottky diode in small sod123f package 6. thermal characteristics [1] device mounted on an fr4 pcb, single-sided copper, tin-plated and standard footprint. [2] re?ow soldering is the only recommended soldering method. [3] soldering point of cathode tab. 7. characteristics [1] pulse test: t p 300 m s; d 0.02. table 6: thermal characteristics symbol parameter conditions min typ max unit r th(j-a) thermal resistance from junction to ambient in free air [1] [2] - - 330 k/w r th(j-sp) thermal resistance from junction to solder point [3] - - 70 k/w table 7: characteristics t amb = 25 c unless otherwise speci?ed. symbol parameter conditions min typ max unit v f forward voltage i f =1ma [1] - - 410 mv i f =10ma [1] - - 750 mv i f =15ma [1] --1 v i r reverse current v r = 50 v - - 100 na v r =70v --10 m a c d diode capacitance v r = 0 v; f = 1 mhz - - 2 pf
9397 750 14967 ? koninklijke philips electronics n.v. 2005. all rights reserved. product data sheet rev. 01 25 april 2005 4 of 8 philips semiconductors BAS70H general-purpose schottky diode in small sod123f package (1) t amb = 125 c (2) t amb =85 c (3) t amb =25 c (4) t amb = - 40 c (1) t amb = 125 c (2) t amb =85 c (3) t amb =25 c fig 1. forward current as a function of forward voltage; typical values fig 2. reverse current as a function of junction temperature t amb =25 c; f = 10 khz t amb =25 c; f = 1 mhz fig 3. differential forward resistance as a function of forward current; typical values fig 4. diode capacitance as a function of reverse voltage; typical values 10 0 0.2 0.4 0.6 0.8 1 1 i f (ma) v f (v) mra803 (1) (4) (2) (3) 10 2 10 - 1 10 - 2 mra805 1 10 10 2 0 20406080 v r (v) i r ( m a) (1) (3) (2) 10 - 1 10 - 2 10 - 3 10 1 110 r dif ( w ) i f (ma) mra802 10 - 1 10 2 10 2 10 3 0 0.5 1 1.5 2 0 20406080 mra804 c d (pf) v r (v)
9397 750 14967 ? koninklijke philips electronics n.v. 2005. all rights reserved. product data sheet rev. 01 25 april 2005 5 of 8 philips semiconductors BAS70H general-purpose schottky diode in small sod123f package 8. package outline 9. packing information [1] for further information and the availability of packing methods, see section 15 . 10. soldering fig 5. package outline sod123f 04-11-29 dimensions in mm 1.2 1.0 0.25 0.10 3.6 3.4 2.7 2.5 0.55 0.35 0.70 0.55 1.7 1.5 1 2 table 8: packing methods the indicated -xxx are the last three digits of the 12nc ordering code. [1] type number package description packing quantity 3000 10000 BAS70H sod123f 4 mm pitch, 8 mm tape and reel -115 -135 re?ow soldering is the only recommended soldering method. dimensions in mm fig 6. re?ow soldering footprint sod123f 1.6 1.6 2.9 4 4.4 1.1 1.2 2.1 1.1 (2 ) solder lands solder resist occupied area solder paste
9397 750 14967 ? koninklijke philips electronics n.v. 2005. all rights reserved. product data sheet rev. 01 25 april 2005 6 of 8 philips semiconductors BAS70H general-purpose schottky diode in small sod123f package 11. revision history table 9: revision history document id release date data sheet status change notice doc. number supersedes BAS70H_1 20050425 product data sheet - 9397 750 14967 -
philips semiconductors BAS70H general-purpose schottky diode in small sod123f package 9397 750 14967 ? koninklijke philips electronics n.v. 2005. all rights reserved. product data sheet rev. 01 25 april 2005 7 of 8 12. data sheet status [1] please consult the most recently issued data sheet before initiating or completing a design. [2] the product status of the device(s) described in this data sheet may have changed since this data sheet was published. the l atest information is available on the internet at url http://www.semiconductors.philips.com. [3] for data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 13. de?nitions short-form speci?cation the data in a short-form speci?cation is extracted from a full data sheet with the same type number and title. for detailed information see the relevant data sheet or data handbook. limiting values de?nition limiting values given are in accordance with the absolute maximum rating system (iec 60134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information applications that are described herein for any of these products are for illustrative purposes only. philips semiconductors make no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. 14. disclaimers life support these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips semiconductors for any damages resulting from such application. right to make changes philips semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. when the product is in full production (status production), relevant changes will be communicated via a customer product/process change noti?cation (cpcn). philips semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise speci?ed. 15. contact information for additional information, please visit: http://www.semiconductors.philips.com for sales of?ce addresses, send an email to: sales.addresses@www.semiconductors.philips.com level data sheet status [1] product status [2] [3] de?nition i objective data development this data sheet contains data from the objective speci?cation for product development. philips semiconductors reserves the right to change the speci?cation in any manner without notice. ii preliminary data quali?cation this data sheet contains data from the preliminary speci?cation. supplementary data will be published at a later date. philips semiconductors reserves the right to change the speci?cation without notice, in order to improve the design and supply the best possible product. iii product data production this data sheet contains data from the product speci?cation. philips semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. relevant changes will be communicated via a customer product/process change noti?cation (cpcn).
? koninklijke philips electronics n.v. 2005 all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. date of release: 25 april 2005 document number: 9397 750 14967 published in the netherlands philips semiconductors BAS70H general-purpose schottky diode in small sod123f package 16. contents 1 product pro?le . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description. . . . . . . . . . . . . . . . . . . . . . 1 1.2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 quick reference data. . . . . . . . . . . . . . . . . . . . . 1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 thermal characteristics. . . . . . . . . . . . . . . . . . . 3 7 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5 9 packing information. . . . . . . . . . . . . . . . . . . . . . 5 10 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 11 revision history . . . . . . . . . . . . . . . . . . . . . . . . . 6 12 data sheet status . . . . . . . . . . . . . . . . . . . . . . . . 7 13 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 14 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 15 contact information . . . . . . . . . . . . . . . . . . . . . 7
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